Existing 3D placement techniques are mainly used for standardcell circuits, while mixed-size placement is needed to support highlevel functional units and intellectual property (I...
Over the past decade, system architectures have started on a clear trend towards increased parallelism and heterogeneity, often resulting in speedups of 10x to 100x. Despite numer...
Hardware implementation of all the basic radix-10 arithmetic operations is evolving as a new trend in the design and implementation of general purpose digital processors. Redundan...
As technology advances, the interconnect delay among modules plays dominant role in chip performance. Buffer insertion, as a traditional approach to reduce wire delay in 2D ICs, i...
Abstract—The proliferation of accelerometers on consumer electronics has brought an opportunity for interaction based on gestures or physical manipulation of the devices. We pres...
Jiayang Liu, Zhen Wang, Lin Zhong, Jehan Wickramas...