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ISPD
2010
ACM
224views Hardware» more  ISPD 2010»
15 years 11 months ago
An analytical placer for mixed-size 3D placement
Existing 3D placement techniques are mainly used for standardcell circuits, while mixed-size placement is needed to support highlevel functional units and intellectual property (I...
Jason Cong, Guojie Luo
LCTRTS
2010
Springer
15 years 11 months ago
Elastic computing: a framework for transparent, portable, and adaptive multi-core heterogeneous computing
Over the past decade, system architectures have started on a clear trend towards increased parallelism and heterogeneity, often resulting in speedups of 10x to 100x. Despite numer...
John Robert Wernsing, Greg Stitt
ARITH
2009
IEEE
15 years 11 months ago
Fully Redundant Decimal Arithmetic
Hardware implementation of all the basic radix-10 arithmetic operations is evolving as a new trend in the design and implementation of general purpose digital processors. Redundan...
Saeid Gorgin, Ghassem Jaberipur
ISQED
2009
IEEE
94views Hardware» more  ISQED 2009»
15 years 11 months ago
Simultaneous buffer and interlayer via planning for 3D floorplanning
As technology advances, the interconnect delay among modules plays dominant role in chip performance. Buffer insertion, as a traditional approach to reduce wire delay in 2D ICs, i...
Xu He, Sheqin Dong, Yuchun Ma, Xianlong Hong
150
Voted
PERCOM
2009
ACM
15 years 11 months ago
uWave: Accelerometer-based Personalized Gesture Recognition and Its Applications
Abstract—The proliferation of accelerometers on consumer electronics has brought an opportunity for interaction based on gestures or physical manipulation of the devices. We pres...
Jiayang Liu, Zhen Wang, Lin Zhong, Jehan Wickramas...
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