3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
In recent years, Software-as-a-Service (SaaS) is gaining momentum with more and more successful adoptions. Several companies including some well known names have embraced this new...
Rapid advances in networking, hardware, and middleware technologies are facilitating the development and deployment of complex grid applications, such as large-scale distributed co...
We describe an application of data mining and decision analysis to the problem of die-level functional test in integrated circuit manufacturing. Integrated circuits are fabricated...
In this paper we present a novel integrated 3D editing environment that combines recent advantages in various fields of computer graphics, such as shape modelling, video-based Hum...
Gerhard H. Bendels, Ferenc Kahlesz, Reinhard Klein