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CODES
2007
IEEE
15 years 6 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
EDBTW
2010
Springer
15 years 5 months ago
ODBIS: towards a platform for on-demand business intelligence services
In recent years, Software-as-a-Service (SaaS) is gaining momentum with more and more successful adoptions. Several companies including some well known names have embraced this new...
Moez Essaidi
COOPIS
2002
IEEE
15 years 4 months ago
Composing and Deploying Grid Middleware Web Services Using Model Driven Architecture
Rapid advances in networking, hardware, and middleware technologies are facilitating the development and deployment of complex grid applications, such as large-scale distributed co...
Aniruddha S. Gokhale, Balachandran Natarajan
KDD
2000
ACM
211views Data Mining» more  KDD 2000»
15 years 3 months ago
Mining IC test data to optimize VLSI testing
We describe an application of data mining and decision analysis to the problem of die-level functional test in integrated circuit manufacturing. Integrated circuits are fabricated...
Tony Fountain, Thomas G. Dietterich, Bill Sudyka
AVI
2004
15 years 1 months ago
Towards the next generation of 3D content creation
In this paper we present a novel integrated 3D editing environment that combines recent advantages in various fields of computer graphics, such as shape modelling, video-based Hum...
Gerhard H. Bendels, Ferenc Kahlesz, Reinhard Klein