In the context of distributed real-time systems as deployed in the avionic and the automotive domain a substantial number of system malfunctions result from connector faults. For ...
For many years, CMOS process scaling has allowed a steady increase in the operating frequency and integration density of integrated circuits. Only recently, however, have we reach...
In this paper, we present a new packaging architecture for chip-level optical interconnections based on imaging fiber bundles. Imaging fiber bundles consist of densely packed arra...
In this work, we propose and investigate the idea of enhancing a System-on-Chip (SoC) communication architecture (the fabric that integrates system components and carries the comm...
Joel Coburn, Srivaths Ravi, Anand Raghunathan, Sri...
Networks-on-Chip (NoCs) interconnection architectures to be used in future billion-transistor Systems-on-Chip (SoCs) meet the major communication requirements of these systems, of...