111 search results - page 19 / 23 » Analysis of power consumption in VLSI global interconnects |
81
Voted
GLVLSI
2003
IEEE
15 years 2 months ago
2003
IEEE
We propose an approach for reducing the energy consumption of address buses that targets both the switching and the crosstalk components of power dissipation. The method is based ...
DATE
2010
IEEE
15 years 2 months ago
2010
IEEE
—Temperature has a strong influence on integrated circuit (IC) performance, power consumption, and reliability. However, accurate thermal analysis can impose high computation co...
ISVLSI
2003
IEEE
15 years 2 months ago
2003
IEEE
Three-dimensional integration technologies have been proposed in order to mitigate design challenges posed by deep-submicron interconnect. By providing multiple layers of active d...
VLSID
2004
IEEE
15 years 10 months ago
2004
IEEE
With increasing demands for high performance by embedded systems, especially by digital signal processing applications, embedded processors must increase available instruction lev...
78
Voted
GLVLSI
2006
IEEE
15 years 3 months ago
2006
IEEE
This paper introduces a standard cell based design for a Serializer and Deserializer (SerDes) communication link. The proposed design is area, power and design time efficient as c...