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» Analysis of power consumption in VLSI global interconnects
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VLSID
2006
IEEE
169views VLSI» more  VLSID 2006»
15 years 10 months ago
A Hybrid SoC Interconnect with Dynamic TDMA-Based Transaction-Less Buses and On-Chip Networks
The two dominant architectural choices for implementing efficient communication fabrics for SoC's have been transaction-based buses and packet-based Networks-onChip (NoC). Bo...
Thomas D. Richardson, Chrysostomos Nicopoulos, Don...
CLUSTER
2007
IEEE
15 years 1 months ago
A feasibility analysis of power-awareness and energy minimization in modern interconnects for high-performance computing
High-performance computing (HPC) systems consume a significant amount of power, resulting in high operational costs, reduced reliability, and wasting of natural resources. Therefor...
Reza Zamani, Ahmad Afsahi, Ying Qian, V. Carl Hama...
ISVLSI
2006
IEEE
150views VLSI» more  ISVLSI 2006»
15 years 3 months ago
Design and Analysis of a Low Power VLIW DSP Core
Power consumption has been the primary issue in processor design, with various power reduction strategies being adopted from system-level to circuitlevel. In order to develop a po...
Chan-Hao Chang, Diana Marculescu
ICCAD
2003
IEEE
123views Hardware» more  ICCAD 2003»
15 years 6 months ago
The Y-Architecture for On-Chip Interconnect: Analysis and Methodology
The Y-architecture for on-chip interconnect is based on pervasive use of 0-, 120-, and 240-degree oriented semi-global and global wiring. Its use of three uniform directions explo...
Hongyu Chen, Chung-Kuan Cheng, Andrew B. Kahng, Io...
TVLSI
2002
144views more  TVLSI 2002»
14 years 9 months ago
On-chip inductance cons and pros
Abstract--This paper provides a high level survey of the increasing effects of on-chip inductance. These effects are classified into desirable and nondesirable effects. Among the u...
Yehea I. Ismail