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IC3
2009
14 years 7 months ago
Multi-scale Modeling and Analysis of Nano-RFID Systems on HPC Setup
In this paper we have worked out on some the complex modeling aspects such as Multi Scale modeling, MATLAB Sugar based modeling and have shown the complexities involved in the anal...
Rohit Pathak, Satyadhar Joshi
GLVLSI
2006
IEEE
112views VLSI» more  GLVLSI 2006»
15 years 3 months ago
A simulation methodology for reliability analysis in multi-core SoCs
Reliability has become a significant challenge for system design in new process technologies. Higher integration levels dramatically increase power densities, which leads to high...
Ayse Kivilcim Coskun, Tajana Simunic Rosing, Yusuf...
JUCS
2008
143views more  JUCS 2008»
14 years 9 months ago
Market Microstructure Patterns Powering Trading and Surveillance Agents
: Market Surveillance plays important mechanism roles in constructing market models. From data analysis perspective, we view it valuable for smart trading in designing legal and pr...
Longbing Cao, Yuming Ou
CLUSTER
2009
IEEE
15 years 4 months ago
Scalable I/O forwarding framework for high-performance computing systems
—Current leadership-class machines suffer from a significant imbalance between their computational power and their I/O bandwidth. While Moore’s law ensures that the computatio...
Nawab Ali, Philip H. Carns, Kamil Iskra, Dries Kim...
ISQED
2007
IEEE
236views Hardware» more  ISQED 2007»
15 years 3 months ago
3DFFT: Thermal Analysis of Non-Homogeneous IC Using 3D FFT Green Function Method
Due to the roaring power dissipation and gaining popularity of 3D integration, thermal dissipation has been a critical concern of modern VLSI design. The availability for chip-lev...
Dongkeun Oh, Charlie Chung-Ping Chen, Yu Hen Hu