6530 search results - page 85 / 1306 » Application Integration |
DAC
2006
ACM
16 years 26 days ago
2006
ACM
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
GMP
2006
IEEE
15 years 6 months ago
2006
IEEE
Physical based and geometric based variational techniques for surface construction have been shown to be advanced methods for designing high quality surfaces in the fields of CAD ...
ACSAC
1999
IEEE
15 years 4 months ago
1999
IEEE
Recently, application-level isolation was introduced as an effective means of containing the damage that a suspicious user could inflict on data. In most cases, only a subset of t...
DEXAW
2004
IEEE
15 years 3 months ago
2004
IEEE
The preservation and representation of folklore collections is a basic priority for every country because they are valuable for studying the customs and the tradition of specific ...
TCOM
2008
14 years 11 months ago
2008
The cumulative distribution function (cdf) of a sum of correlated or even independent lognormal random variables (RVs), which is of wide interest in wireless communications, remain...