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ISCA
2008
IEEE
188views Hardware» more  ISCA 2008»
15 years 11 months ago
MIRA: A Multi-layered On-Chip Interconnect Router Architecture
Recently, Network-on-Chip (NoC) architectures have gained popularity to address the interconnect delay problem for designing CMP / multi-core / SoC systems in deep sub-micron tech...
Dongkook Park, Soumya Eachempati, Reetuparna Das, ...
RTSS
2008
IEEE
15 years 11 months ago
A Holistic Approach to Decentralized Structural Damage Localization Using Wireless Sensor Networks
Wireless sensor networks (WSNs) have become an increasingly compelling platform for Structural Health Monitoring (SHM) applications, since they can be installed relatively inexpen...
Gregory Hackmann, Fei Sun, Nestor Castaneda, Cheny...
ICCCN
2007
IEEE
15 years 11 months ago
Interplay of Security and Reliability using Non-uniform Checkpoints
Real time applications such as military aircraft flight control systems and online banking are critical with respect to security and reliability. In this paper we presented a way ...
Kiranmai Bellam, Raghava K. Vudata, Xiao Qin, Zili...
IRI
2007
IEEE
15 years 11 months ago
The Software Reuse Working Group: A Case Study in Fostering Reuse
Packaging software assets for reuse can improve the potential for others to adopt the software. Packaging the software with appropriate documentation and other resources can facil...
Ryan Gerard, Robert R. Downs, James J. Marshall, R...
MICRO
2007
IEEE
150views Hardware» more  MICRO 2007»
15 years 11 months ago
Leveraging 3D Technology for Improved Reliability
Aggressive technology scaling over the years has helped improve processor performance but has caused a reduction in processor reliability. Shrinking transistor sizes and lower sup...
Niti Madan, Rajeev Balasubramonian