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FCCM
2005
IEEE
115views VLSI» more  FCCM 2005»
15 years 3 months ago
FIFO Communication Models in Operating Systems for Reconfigurable Computing
Increasing demands upon embedded systems for higher level services like networking, user interfaces and file system management, are driving growth in fully-featured operating syst...
John A. Williams, Neil W. Bergmann, X. Xie
IPPS
2003
IEEE
15 years 2 months ago
Targeting Tiled Architectures in Design Exploration
Tiled architectures can provide a model for early estimation of global interconnect costs. A design exploration tool for reconfigurable architectures is currently under developmen...
Lilian Bossuet, Wayne Burleson, Guy Gogniat, Vikas...
DATE
2010
IEEE
180views Hardware» more  DATE 2010»
15 years 2 months ago
Integration, cooling and packaging issues for aerospace equipments
—Packaging becomes an important issue in aerospace equipments because of high integration and severe environmental constraints. In order to develop products which respond to the ...
Claude Sarno, C. Tantolin
ISCAS
2006
IEEE
135views Hardware» more  ISCAS 2006»
15 years 3 months ago
A sensor system on chip for wireless microsystems
Recent years have seen the rapid development of microsensor technology, system on chip design, wireless technology and ubiquitous computing. When assembled into a complex microsys...
L. Wang, Nizamettin Aydin, A. Astaras, M. Ahmadian...
DATE
2007
IEEE
143views Hardware» more  DATE 2007»
15 years 4 months ago
Portable multimedia SoC design: a global challenge
- The intrinsic capability brought by each new technology node opens the way to a broad range of system integration options and continuously enables new applications to be integrat...
Maurizio Paganini, Georg Kimmich, Stephane Ducrey,...