1934 search results - page 12 / 387 » Application specific NoC design |
ASPDAC
2009
ACM
15 years 4 months ago
2009
ACM
Three-dimensional stacking of silicon layers is emerging as a promising solution to handle the design complexity and heterogeneity of Systems on Chips (SoCs). Networks on Chips (N...
TCAD
2010
14 years 4 months ago
2010
Three-dimensional integrated circuits (3D-ICs) are a promising approach to address the integration challenges faced by current systems on chips (SoCs). Designing an efficient netwo...
DATE
2008
IEEE
15 years 4 months ago
2008
IEEE
Applications from the embedded consumer domain put challenging requirements on SoC infrastructures, i.e. interconnect and memory. Specifically, video applications demand large sto...
ETS
2006
IEEE
15 years 3 months ago
2006
IEEE
This paper proposes a wrapper design for interconnects with guaranteed bandwidth and latency services and on-chip protocol. strate that these interconnects abstract the interconne...
DELTA
2008
IEEE
15 years 4 months ago
2008
IEEE
The advances of CMOS technology towards 45 nm, the high costs of ASIC design, power limitations and fast changing application requirements have stimulated the usage of highly reco...