1927 search results - page 109 / 386 » Application-Aware Power Management |
NOCS
2010
IEEE
14 years 9 months ago
2010
IEEE
—Three-dimensional network-on-chip (3D NoC), the combination of NoC and die-stacking 3D IC technology, is motivated to achieve lower latency, lower power consumption, and higher ...
ISCA
2007
IEEE
15 years 5 months ago
2007
IEEE
With increasing speed and power density, high-performance memories, including FB-DIMM (Fully Buffered DIMM) and DDR2 DRAM, now begin to require dynamic thermal management (DTM) a...
ICCAD
2004
IEEE
15 years 8 months ago
2004
IEEE
New embedded systems offer rich power management features in the form of multiple operational and non-operational power modes. While they offer mechanisms for better energy effic...
CODES
2001
IEEE
15 years 2 months ago
2001
IEEE
New embedded systems must be power-aware, not just low-power. That is, they must track their power sources and the changingpower and performance constraints imposed by the environ...
DT
2006
14 years 11 months ago
2006
The ITRS (International Technology Roadmap for Semiconductors) predicts aggressive scaling down of device size, transistor threshold voltage and oxide thickness to meet growing de...