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DAC
2011
ACM
13 years 11 months ago
Non-uniform micro-channel design for stacked 3D-ICs
Micro-channel cooling shows great potential in removing high density heat in 3D circuits. The current micro-channel heat sink designs spread the entire surface to be cooled with m...
Bing Shi, Ankur Srivastava, Peng Wang
FPT
2005
IEEE
134views Hardware» more  FPT 2005»
15 years 5 months ago
Post-Silicon Debug Using Programmable Logic Cores
Producing a functionally correct integrated circuit is becoming increasingly difficult. No matter how careful a designer is, there will always be integrated circuits that are fabr...
Bradley R. Quinton, Steven J. E. Wilton
DAC
2005
ACM
15 years 1 months ago
Variation-tolerant circuits: circuit solutions and techniques
Die-to-die and within-die variations impact the frequency and power of fabricated dies, affecting functionality, performance, and revenue. Variation-tolerant circuits and post-sil...
James Tschanz, Keith A. Bowman, Vivek De
VLSID
2004
IEEE
75views VLSI» more  VLSID 2004»
16 years 2 days ago
Quantitative Model for Thermal Behaviour of an Analog Integrated Circuit
Gagandeep S. Sandha, Pawan K. Singh, C. Pradeep Ku...
SIGOPSE
1994
ACM
15 years 3 months ago
New Directions for Integrated Circuit Cards Operating Systems
Integrated circuit cards or smart cards are now well-known. Applications such as electronic purses (cash units stored in cards), subscriber identification cards used in cellular te...
Pierre Paradinas, Jean-Jacques Vandewalle