1398 search results - page 279 / 280 » Application-Specific Integrated Circuits |
VTC
2010
IEEE
13 years 4 months ago
2010
IEEE
Abstract—It is widely recognized that differential decode-andforward (DDF) cooperative transmission scheme is capable of providing a superior performance compared to classic dire...
ICCAD
2009
IEEE
13 years 4 months ago
2009
IEEE
In a behavioral synthesis system, a typical approach used to guide the scheduler is to impose hard constraints on the relative timing between operations considering performance, a...
ICCAD
2009
IEEE
13 years 4 months ago
2009
IEEE
Modern circuits become harder to route with the ever decreasing design features. Previous routability-driven placement techniques are usually tightly coupled with the underlying p...
ICCAD
2009
IEEE
13 years 4 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
TCAD
2011
13 years 1 months ago
2011
—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...