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ISSS
1997
IEEE
103views Hardware» more  ISSS 1997»
15 years 1 months ago
A Source-Level Dynamic Analysis Methodology and Tool for High-Level Synthesis
This paper presents a novel source-level dynamic analysis methodology and tool for High-Level Synthesis (HLS). It not only for the first time enables HLS to offer source-level de...
Chih-Tung Chen, Kayhan Küçük&cced...
DAC
2010
ACM
15 years 1 months ago
Networks on Chips: from research to products
Research on Networks on Chips (NoCs) has spanned over a decade and its results are now visible in some products. Thus the seminal idea of using networking technology to address th...
Giovanni De Micheli, Ciprian Seiculescu, Srinivasa...
ISCAS
2005
IEEE
164views Hardware» more  ISCAS 2005»
15 years 3 months ago
A 3-way SIMD engine for programmable triangle setup in embedded 3D graphics hardware
—A triangle setup engine (TSE) generates setup parameters for rasterization in 3D graphics hardware. Since the TSE must be flexible for various embedded systems, a programmable T...
Kyusik Chung, Donghyun Kim, Lee-Sup Kim
DAC
2006
ACM
15 years 10 months ago
Optimality study of resource binding with multi-Vdds
Deploying multiple supply voltages (multi-Vdds) on one chip is an important technique to reduce dynamic power consumption. In this work we present an optimality study for resource...
Deming Chen, Jason Cong, Yiping Fan, Junjuan Xu
DSD
2009
IEEE
84views Hardware» more  DSD 2009»
15 years 4 months ago
Temperature- and Cost-Aware Design of 3D Multiprocessor Architectures
— 3D stacked architectures provide significant benefits in performance, footprint and yield. However, vertical stacking increases the thermal resistances, and exacerbates tempe...
Ayse Kivilcim Coskun, Andrew B. Kahng, Tajana Simu...