Cache memories were invented to decouple fast processors from slow memories. However, this decoupling is only partial, and many researchers have attempted to improve cache use by p...
Future high-performance billion-transistor processors are likely to employ partitioned architectures to achieve high clock speeds, high parallelism, low design complexity, and low...
3D-integration is a promising technology to help combat the “Memory Wall” in future multi-core processors. Past work has considered using 3D-stacked DRAM as a large last-level...
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
Hao Hua, Christopher Mineo, Kory Schoenfliess, Amb...