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CODES
2007
IEEE
15 years 11 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
CODES
2007
IEEE
15 years 11 months ago
Performance modeling for early analysis of multi-core systems
Performance analysis of microprocessors is a critical step in defining the microarchitecture, prior to register-transfer-level (RTL) design. In complex chip multiprocessor systems...
Reinaldo A. Bergamaschi, Indira Nair, Gero Dittman...
ICEBE
2007
IEEE
174views Business» more  ICEBE 2007»
15 years 11 months ago
Worksheet-Driven UMM Modeling of B2B Services
In the development process of a B2B system it is crucial that the business experts are able to express and evaluate agreements and commitments between the partners and that the so...
Christian Huemer, Marco Zapletal, Philipp Liegl, R...
COMSWARE
2006
IEEE
15 years 11 months ago
Resource management in heterogenous wireless networks with overlapping coverage
— Development in new radio technologies and increase in user demands are driving the deployment of a wide array of wireless networks, ranging from 802.11 networks in the local ar...
Bin Bin Chen, Mun Choon Chan
SKG
2006
IEEE
15 years 11 months ago
Mathematics Computing Environment on the Web
With the rapid evolution of web technology and Internet, the mathematical web has emerged as a new research trend, which changes the traditional manner of mathematical scientific ...
Li Liu, Yi Yang, Lian Li