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TCAD
2010
160views more  TCAD 2010»
14 years 10 months ago
SunFloor 3D: A Tool for Networks on Chip Topology Synthesis for 3-D Systems on Chips
Three-dimensional integrated circuits (3D-ICs) are a promising approach to address the integration challenges faced by current systems on chips (SoCs). Designing an efficient netwo...
Ciprian Seiculescu, Srinivasan Murali, Luca Benini...
TCOS
2010
14 years 10 months ago
Green Secure Processors: Towards Power-Efficient Secure Processor Design
With the increasing wealth of digital information stored on computer systems today, security issues have become increasingly important. In addition to attacks targeting the softwar...
Siddhartha Chhabra, Yan Solihin
184
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FCCM
1999
IEEE
210views VLSI» more  FCCM 1999»
15 years 8 months ago
Algorithm Analysis and Mapping Environment for Adaptive Computing Systems: Further Results
Abstract We are developing an integrated algorithm analysis and mapping environment particularly tailored for signal processing applications on Adaptive Computing Systems ACS. Our ...
Eric K. Pauer, Paul D. Fiore, John M. Smith
CSFW
2011
IEEE
14 years 3 months ago
Local Memory via Layout Randomization
—Randomization is used in computer security as a tool to introduce unpredictability into the software infrastructure. In this paper, we study the use of randomization to achieve ...
Radha Jagadeesan, Corin Pitcher, Julian Rathke, Ja...
DAC
2011
ACM
14 years 3 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi