5604 search results - page 63 / 1121 » Becoming Increasingly Reliable |
109
click to vote
ICCAD
2009
IEEE
14 years 9 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
INFOCOM
2010
IEEE
14 years 9 months ago
2010
IEEE
We examine the problem of minimizing feedbacks in reliable wireless broadcasting, by pairing rateless coding with extreme value theory. Our key observation is that, in a broadcast ...
ICCAD
2006
IEEE
15 years 8 months ago
2006
IEEE
With shrinking feature size and growing integration density in the Deep Sub-Micron technologies, the global buses are fast becoming the “weakest-links” in VLSI design. They ha...
125
click to vote
CODES
2010
IEEE
14 years 10 months ago
2010
IEEE
With the continuous scaling of semiconductor technology, the life-time of circuit is decreasing so that processor failure becomes an important issue in MPSoC design. A software so...
CIKM
2003
Springer
15 years 5 months ago
2003
Springer
As online document collections continue to expand, both on the Web and in proprietary environments, the need for duplicate detection becomes more critical. Few users wish to retri...