As manufacturing technology enters the ultra-deep submicron era, wafer yields are destined to drop due to higher occurrence of physical defects on the die. This paper proposes a y...
Nicola Campregher, Peter Y. K. Cheung, George A. C...
Truly generic and reusable intelligent tutoring software architectures have remained elusive. As part of our effort to develop tutoring systems for simulations of ill-defined doma...
Dave Gomboc, Mark G. Core, H. Chad Lane, Ashish Ka...
Abstract-- This paper considers the problem of model reduction for controlled systems. The paper considers a dual/adjoint formulation of the general optimization problem to minimiz...
Die-to-die and within-die variations impact the frequency and power of fabricated dies, affecting functionality, performance, and revenue. Variation-tolerant circuits and post-sil...
This paper discusses non-parametric regression between Riemannian manifolds. This learning problem arises frequently in many application areas ranging from signal processing, comp...