3106 search results - page 554 / 622 » Both Generic Design and Different Forms of Designing |
MICRO
2006
IEEE
15 years 3 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
P2P
2006
IEEE
15 years 3 months ago
2006
IEEE
P2P systems that rely on the voluntary contribution of bandwidth by the individual peers may suffer from freeriding. To address this problem, mechanisms enforcing fairness in band...
JCDL
2006
ACM
15 years 3 months ago
2006
ACM
In this paper we present a method of parsing unstructured textual records briefly describing a person and their direct relatives, which we use in the construction of a browsing t...
114
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ASIACRYPT
2005
Springer
15 years 3 months ago
2005
Springer
Cryptosystems based on the knapsack problem were among the first public-key systems to be invented. Their high encryption/decryption rate attracted considerable interest until it ...
111
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ASPLOS
2004
ACM
15 years 3 months ago
2004
ACM
Increased integration in the form of multiple processor cores on a single die, relatively constant die sizes, shrinking power envelopes, and emerging applications create a new cha...