Gold to Gold Interconnection (GGI) flip chip bonding technology has been developed to bond the driver IC chip on the integrated circuit suspension used in hard disk drives (HDDs)....
This paper presents an approach to the analysis of transient thermal states in electronic circuits using an analytical solution of the heat equation. Fully three-dimensional analy...
Marcin Janicki, Gilbert De Mey, Andrzej Napieralsk...
Mobile devices, like sensor networks and MEMS actuators use mobile power supplies to ensure energy for their operation. These are mostly batteries. The lifetime of the devices dep...
A new approach for resource based optimization for high performance integrated circuits is presented. The methodology is applied to simultaneous shield and repeater insertion, resu...
Abstract—The design of integrated circuits involves the consideration of a large number of constraints of various types. In addition to the definition of these constraints in a ...