1343 search results - page 91 / 269 » Bounded-lifetime integrated circuits |
115
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DAC
2010
ACM
15 years 1 months ago
2010
ACM
With technology scaling down to 90nm and below, many yield-driven design and optimization methodologies have been proposed to cope with the prominent process variation and to incr...
103
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TCAD
2008
15 years 21 days ago
2008
Starting at the 65-nm node, stress engineering to improve the performance of transistors has been a major industry focus. An intrinsic stress source--shallow trench isolation (STI)...
115
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TVLSI
2008
15 years 20 days ago
2008
As CMOS technology scales deeper into the nanometer regime, factors such as leakage power and chip temperature emerge as critically important concerns for high-performance VLSI des...
113
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VLSID
2010
IEEE
14 years 11 months ago
2010
IEEE
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...
125
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ICCAD
2009
IEEE
14 years 10 months ago
2009
IEEE
Process and environmental variations continue to present significant challenges to designers of high-performance integrated circuits. In the past few years, while much research has...