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CODES
2007
IEEE
15 years 4 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
BMCBI
2006
202views more  BMCBI 2006»
14 years 9 months ago
Integrated biclustering of heterogeneous genome-wide datasets for the inference of global regulatory networks
Background: The learning of global genetic regulatory networks from expression data is a severely under-constrained problem that is aided by reducing the dimensionality of the sea...
David J. Reiss, Nitin S. Baliga, Richard Bonneau
WWW
2010
ACM
15 years 4 months ago
Exploring web scale language models for search query processing
It has been widely observed that search queries are composed in a very different style from that of the body or the title of a document. Many techniques explicitly accounting for...
Jian Huang 0002, Jianfeng Gao, Jiangbo Miao, Xiaol...
AAAI
1998
14 years 11 months ago
Producing BT's Yellow Pages with Formation
This case study illustrates how the adoption of AI technology can bene t smaller companies as well as major corporations. Pindar Set is a small UK company which has originated the...
Gail Anderson, Andrew Casson-du Mont, Ann Macintos...
JAVA
2000
Springer
15 years 1 months ago
Development routes for message passing parallelism in Java
Java is an attractive environment for writing portable message passing parallel programs. Considerable work in message passing interface bindings for the C and Fortran languages h...
J. A. Mathew, Heath A. James, Kenneth A. Hawick