44 search results - page 6 / 9 » CAD challenges for 3D ICs |
VLSID
2010
IEEE
14 years 8 months ago
2010
IEEE
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...
ICASSP
2007
IEEE
15 years 4 months ago
2007
IEEE
Lung nodule detection, especially ground glass opacity (GGO) detection, in helical computed tomography (CT) images is a challenging Computer-Aided Detection (CAD) task due to the ...
CORR
2008
Springer
14 years 10 months ago
2008
Springer
Abstract-Two dimensional (2D) integration has been the traditional approach for IC integration. Increasing demands for providing electronic devices with superior performance and fu...
JEI
2006
14 years 9 months ago
2006
We present our research efforts toward the deployment of 3-D sensing technology to an under-vehicle inspection robot. The 3-D sensing modality provides flexibility with ambient lig...
JETC
2008
14 years 8 months ago
2008
With aggressive reductions in feature sizes and the integration of multiple functionalities on the same die, bottlenecks due to I/O pin limitations have become a severe issue in to...