44 search results - page 7 / 9 » CAD challenges for 3D ICs |
ICCD
2005
IEEE
15 years 6 months ago
2005
IEEE
As technology scales, interconnects dominate the performance and power behavior of deep submicron designs. Three-dimensional integrated circuits (3D ICs) have been proposed as a w...
CAD
2006
Springer
14 years 9 months ago
2006
Springer
We study the problem of enabling general 2D and 3D variational constraint representation to be used in conjunction with a feature hierarchy representation, where some of the featu...
HOST
2008
IEEE
15 years 4 months ago
2008
IEEE
Abstract: Circuit CAD Tools as a Security Threat Jarrod A. Roy†, Farinaz Koushanfar‡ and Igor L. Markov† †The University of Michigan, Department of EECS, 2260 Hayward Ave.,...
TVLSI
1998
14 years 9 months ago
1998
— Wave-pipelining is a method of high-performance circuit design which implements pipelining in logic without the use of intermediate latches or registers. The combination of hig...
CAD
2006
Springer
14 years 9 months ago
2006
Springer
Modeling, design and fabrication of tissue scaffolds with intricate architecture, porosity and pore size for desired tissue properties presents a challenge in tissue engineering. ...