43 search results - page 2 / 9 » Capacitive Leadframe Testing |
GLVLSI
2006
IEEE
14 years 10 days ago
2006
IEEE
Process variations have become a serious concern for nanometer technologies. The interconnect and device variations include interand intra-die variations of geometries, as well as...
EUROCAST
2007
Springer
14 years 13 days ago
2007
Springer
Abstract. In this paper the author presents three approaches to parallel Tabu Search, applied to several instances of the Capacitated Vehicle Routing Problem with soft Time Windows...
ASPDAC
2006
ACM
14 years 7 days ago
2006
ACM
Abstract— An efficient algorithm for three-dimensional (3D) capacitance extraction on multi-layered and lossy substrate is presented. The new algorithm represents a major improv...
DELTA
2006
IEEE
14 years 10 days ago
2006
IEEE
In high speed digital circuits, the inductive effect is more dominant compared to capacitive effect. In particular, as the technology is shrinking, the spacing between interconnec...
DAC
1999
ACM
13 years 10 months ago
1999
ACM
As the family of Alpha microprocessors continues to scale into more advanced technologies with very high frequency edge rates and multiple layers of interconnect, the issue of cha...