852 search results - page 103 / 171 » Categories, Allegories and Circuit Design |
ICCAD
2006
IEEE
15 years 8 months ago
2006
IEEE
High power consumption will shorten battery life for handheld devices and cause thermal and reliability problems. One way to lower the dynamic power consumption is to reduce the s...
ISPD
2010
ACM
15 years 6 months ago
2010
ACM
In the nanometer IC design, dummy fill is often performed to improve layout pattern uniformity and the post-CMP quality. However, filling dummies might greatly increase intercon...
100
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DAC
2007
ACM
16 years 27 days ago
2007
ACM
Minimizing power consumption is vitally important in embedded system design; power consumption determines battery lifespan. Ultralow-power designs may even permit embedded systems...
301
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DAC
2012
ACM
13 years 2 months ago
2012
ACM
Due to the breakdown of Dennardian scaling, the percentage of a silicon chip that can switch at full frequency is dropping exponentially with each process generation. This utiliza...
109
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ICCAD
2009
IEEE
14 years 9 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...