852 search results - page 22 / 171 » Categories, Allegories and Circuit Design |
84
Voted
DAC
2006
ACM
15 years 5 months ago
2006
ACM
Silicon design implementation has become increasingly complex with the deep submicron technologies such as 90nm and below. It is common to see multiple processor cores, several ty...
DAC
2008
ACM
16 years 23 days ago
2008
ACM
An energy optimization is proposed that addresses the nontrivial digital contribution to power and impact on performance in high-speed mixed-signal circuits. Parallel energy and b...
ICCAD
2009
IEEE
14 years 9 months ago
2009
IEEE
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
DAC
2011
ACM
13 years 11 months ago
2011
ACM
In the era of deep sub-wavelength lithography for nanometer VLSI designs, manufacturability and yield issues are critical and need to be addressed during the key physical design i...
197
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GLVLSI
2011
IEEE
14 years 3 months ago
2011
IEEE
Existing optimization algorithms for the multiplierless realization of multiple constant multiplications (MCM) typically target the minimization of the number of addition and subt...