In this work, we propose an efficient and accurate full-chip thermomechanical stress and reliability analysis tool and design optimization methodology to alleviate mechanical rel...
Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Ky...
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
eriodically time-varying (LPTV) abstractions are useful for a variety of communication and computer subsystems. In this paper, we present a novel operator-based model-order reduct...
Resource based optimization for high performance integrated circuits is presented. The methodology is applied to simultaneous shield and repeater insertion, resulting in minimum c...
In this paper, we propose more accurate power/ground network circuit model, which consider both via and ground bounce effects to improve the performance estimation accuracy of on-...
Jin Shi, Yici Cai, Sheldon X.-D. Tan, Xianlong Hon...