Physical phenomena such as temperature have an increasingly important role in performance and reliability of modern process technologies. This trend will only strengthen with futu...
Rajarshi Mukherjee, Seda Ogrenci Memik, Gokhan Mem...
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
Gian Luca Loi, Banit Agrawal, Navin Srivastava, Sh...
The cost functions used to evaluate logic synthesis transformations for FPGAs are far removed from the final speed and routability determined after placement, routing and timing a...
In this paper we introduce a new method of performing direct solution of the harmonic balance Jacobian. For examples with moderate number of harmonics and moderate to strong nonli...
In deep submicron circuits, thermal hot spots and high temperature gradients increase the cooling costs, and degrade reliability and performance. In this paper, we propose a low-co...