4870 search results - page 235 / 974 » Challenges of component-based development |
116
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ASPDAC
2012
ACM
14 years 3 days ago
2012
ACM
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
111
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ICCV
2005
IEEE
16 years 6 months ago
2005
IEEE
In this paper we propose an approach to vehicle classification under a mid-field surveillance framework. We develop a repeatable and discriminative feature based on edge points an...
131
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ICIP
2002
IEEE
16 years 6 months ago
2002
IEEE
A challenge of image communication over unreliable channels is to achieve good compression rates and be effective in presence of channel failures. In this work we use the Multiple...
132
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DAC
1999
ACM
16 years 5 months ago
1999
ACM
A 550MHz 64b PowerPC processor was developed for fabrication in Silicon-On-Insulator (SOI) technology from a processor previously designed and fabricated in bulk CMOS [1]. Both th...
130
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WWW
2004
ACM
16 years 5 months ago
2004
ACM
In this paper, we describe the notion of a semantic information portal. This is a community information portal that exploits the semantic web standards to improve structure, exten...