—Social Networks will unfold their full potential when connected people are enabled to collaborate - any time, appropriate to the current location, activity and computing environ...
Daniel Schuster, Thomas Springer, Alexander Schill
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
To answer the challenges of globally distributed organizations facing constant transformation of work, means of ICT supported interorganizational knowledge-creation is needed. Firs...
Due to the inherent nature of their heterogeneity, resource scarcity and dynamism, the provision of middleware for future networked embedded environments is a challenging task. In...
Paolo Costa, Geoff Coulson, Richard Gold, Manish L...
—An energy-efficient, reliable and timely data transmission is essential for wireless sensor networks (WSNs) employed in scenarios where plant information must be available for ...
Pan Gun Park, Carlo Fischione, Alvise Bonivento, K...