466 search results - page 12 / 94 » Channels that Heat Up |
87
Voted
DATE
2009
IEEE
15 years 6 months ago
2009
IEEE
— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
IUI
2003
ACM
15 years 5 months ago
2003
ACM
This work explores the use of ambient displays in the context of interruption. A multimodal interface was created to communicate with users by using two ambient channels for inter...
116
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VLSID
2009
IEEE
16 years 11 days ago
2009
IEEE
In this paper, we present a dynamic power management technique for optimizing the use of virtual channels in network on chips. The technique which is called dynamic virtual channe...
DAC
2006
ACM
16 years 22 days ago
2006
ACM
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
92
Voted
SECON
2007
IEEE
15 years 6 months ago
2007
IEEE
— The coverage and connectivity problem in sensor networks has received significant attention of the research community in the recent years. In this paper, we study this problem...