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137
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ISVLSI
2003
IEEE
15 years 10 months ago
2003
IEEE
Three-dimensional integration technologies have been proposed in order to mitigate design challenges posed by deep-submicron interconnect. By providing multiple layers of active d...
134
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SBCCI
2003
ACM
15 years 10 months ago
2003
ACM
As we scale down to deep submicron (DSM) technology, noise is becoming a metric of equal importance as power, speed, and area. Smaller feature sizes, low voltage, and high frequen...
163
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ANSS
2002
IEEE
15 years 10 months ago
2002
IEEE
The data traffic in wireless networks for the third generation (3G) mobile telecommunication systems should take into account a variety of services (voice, data, video) and envir...
177
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ICPADS
2002
IEEE
15 years 10 months ago
2002
IEEE
The emergence of mobile ad hoc sensor networks has brought new challenges to traditional network design. This paper focuses on the study at the application layer. In specific, it...
156
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EUROPAR
2009
Springer
15 years 10 months ago
2009
Springer
The paper presents a new data partitioning algorithm for parallel computing on heterogeneous processors. Like traditional functional partitioning algorithms, the algorithm assumes ...