Memory requirements of intellectual property components (IP) in contemporary multi-processor systems-on-chip are increasing. Large high-speed external memories, such as DDR2 SDRAM...
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Multiple wireless technologies are converging to run on personal handhelds. The plethora of communication standards next to the cost issues of deeper submicron processing require ...
A. C. H. Ng, J. W. Weijers, Miguel Glassee, Thomas...
Abstract— This paper investigates the dissemination of multiple pieces of information in large networks where users contact each other in a random uncoordinated manner, and users...
Sujay Sanghavi, Bruce Hajek, Laurent Massouli&eacu...
Software vulnerabilities have been the main contributing factor to the Internet security problems such as fast spreading worms. Among these software vulnerabilities, memory corrup...