ing models and HW-SW Interfaces Abstraction for Multi-Processor SoC Ahmed A. Jerraya TIMA Laboratory 46 Ave Felix Viallet 38031 Grenoble CEDEX, France +33476574759 Ahmed.Jerraya@im...
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
Pingqiang Zhou, Yuchun Ma, Zhuoyuan Li, Robert P. ...
Modern microprocessor designs continue to obtain impressive performance gains through increasing clock rates and advances in the parallelism obtained via micro-architecture design...
Recently, flash-based solid-state drives (SSDs) have become standard options for laptop and desktop storage, but their impact on enterprise server storage has not been studied. P...
Dushyanth Narayanan, Eno Thereska, Austin Donnelly...
The aging population and the growing amount of medical data have increased the need for automated tools in the neurology departments. Although the researchers have been developing ...