Design Constraints imposed by global interconnect delays as well as limitations in integration of disparate technologies make 3-D chip stacks an enticing technology solution for m...
Awet Yemane Weldezion, Matt Grange, Dinesh Pamunuw...
Abstract— The amount of energy consumed for interconnecting the IP-blocks is increasing significantly due to the suboptimal scaling of long wires. To limit this energy penalty, ...
Jin Guo, Antonis Papanikolaou, Pol Marchal, Franck...
The explosive growth in the performance of microprocessors and networks has created a new opportunity to reduce the latency of fine-grain communication. Microprocessor clock speed...
Designers of distributed embedded systems face many challenges in determining the appropriate tradeoffs to make when defining a system architecture or retargeting an existing desi...
System on Chip architectures have traditionally relied upon bus based interconnect for their communication needs. However, increasing bus frequencies and the load on the bus calls...