Collaborative applications with energy and low-delay constraints are emerging in various networked embedded systems like wireless sensor networks and multimedia terminals. Conventi...
The rapidly increasing energy consumption by computing and communications equipment is a significant economic and environmental problem that needs to be addressed. Ethernet network...
Chamara Gunaratne, Kenneth J. Christensen, Bruce N...
Abstract-- Preventing silicon chips from negative, even disastrous thermal hazards has become increasingly challenging these days; considering thermal effects early in the design c...
Wei Huang, Karthik Sankaranarayanan, Kevin Skadron...
Due to the increasing abstraction gap between the initial system model and a final implementation, the verification of the respective models against each other is a formidable task...
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...