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135
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ICCAD
2009
IEEE
15 years 3 months ago
2009
IEEE
The flip-chip package is introduced for modern IC designs with higher integration density and larger I/O counts. In this paper, we consider the pre-assignment flip-chip routing pr...
154
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ICCAD
2009
IEEE
15 years 3 months ago
2009
IEEE
Pre-bond testing of 3D stacked ICs involves testing individual dies before bonding. The overall yield of 3D ICs improves with prebond testability because designers can avoid stack...
155
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ICCAD
2009
IEEE
15 years 3 months ago
2009
IEEE
A parallel computing approach for large-scale SPICE-accurate circuit simulation is described that is based on a new preconditioned iterative solver. The preconditioner involves the...
167
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ICCAD
2009
IEEE
15 years 3 months ago
2009
IEEE
As VLSI technology reaches 45nm technology node, leakage power optimization has become a major design challenge. Threshold voltage (vt) assignment has been extensively studied, du...
151
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ICCAD
2009
IEEE
15 years 3 months ago
2009
IEEE
SRAM cell design is driven by the need to satisfy static noise margin, write margin and read current margin (RCM) over all cells in the array in an energy-efficient manner. These ...