In this paper, we present a new method for surface extraction from volume data which preserves sharp features, maintains consistent topology and generates surface adaptively witho...
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Networks-on-chip (NoCs) are becoming increasingly important in general-purpose and application-specific multi-core designs. Although uniform router configurations are appropriate ...
Andrew B. Kahng, Bill Lin, Kambiz Samadi, Rohit Su...
Abstract. The ability to cooperate on common tasks in a distributed setting is key to solving a broad range of computation problems ranging from distributed search such as SETI to ...
Chryssis Georgiou, Alexander Russell, Alexander A....
Providing up-to-date input to users’ applications is an important data management problem for a distributed computing environment, where each data storage location and intermedi...
Mitchell D. Theys, Noah Beck, Howard Jay Siegel, M...