5595 search results - page 792 / 1119 » Comparing Subsumption Optimizations |
196
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ICCD
2007
IEEE
16 years 4 months ago
2007
IEEE
Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
186
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ICCD
2006
IEEE
16 years 4 months ago
2006
IEEE
— Identifying performance bottlenecks is important for microarchitects and application developers to produce high performance microprocessor designs and application software. Man...
197
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ICCD
2004
IEEE
16 years 4 months ago
2004
IEEE
Three dimensional vertically integrated systems allow active devices to be placed on multiple device layers. In recent years, a number of research efforts have addressed physical ...
212
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ICCD
2002
IEEE
16 years 4 months ago
2002
IEEE
— In this paper, we present a new interconnect delay model called Fitted Elmore delay (FED). FED is generated by approximating Hspice delay data using a curve fitting technique....
165
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ICCD
2002
IEEE
16 years 4 months ago
2002
IEEE
During the course of a program’s execution, a processor performs many trivial computations; that is, computations that can be simplified or where the result is zero, one, or equ...