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151
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ASPDAC
2009
ACM
15 years 11 months ago
2009
ACM
Three-dimensional stacking of silicon layers is emerging as a promising solution to handle the design complexity and heterogeneity of Systems on Chips (SoCs). Networks on Chips (N...
137
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ISCA
2007
IEEE
15 years 10 months ago
2007
IEEE
With increasing speed and power density, high-performance memories, including FB-DIMM (Fully Buffered DIMM) and DDR2 DRAM, now begin to require dynamic thermal management (DTM) a...
137
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GLVLSI
2006
IEEE
15 years 10 months ago
2006
IEEE
3-dimensional integrated circuit (3D IC) technology places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to conventional plan...
133
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MSWIM
2004
ACM
15 years 10 months ago
2004
ACM
Recent trends in sensor network simulation can be divided between less flexible but accurate emulation based approach and more generic but less detailed network simulator models....
149
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ICPP
2002
IEEE
15 years 9 months ago
2002
IEEE
A software cache implements instruction and data caching entirely in software. Dynamic binary rewriting offers a means to specialize the software cache miss checks at cache miss t...