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HPCA
2007
IEEE
16 years 4 months ago
Thermal Herding: Microarchitecture Techniques for Controlling Hotspots in High-Performance 3D-Integrated Processors
3D integration technology greatly increases transistor density while providing faster on-chip communication. 3D implementations of processors can simultaneously provide both laten...
Kiran Puttaswamy, Gabriel H. Loh
ICCAD
2006
IEEE
103views Hardware» more  ICCAD 2006»
16 years 1 months ago
A statistical framework for post-silicon tuning through body bias clustering
Adaptive body biasing (ABB) is a powerful technique that allows post-silicon tuning of individual manufactured dies such that each die optimally meets the delay and power constrai...
Sarvesh H. Kulkarni, Dennis Sylvester, David Blaau...
DATE
2009
IEEE
168views Hardware» more  DATE 2009»
15 years 11 months ago
Selective state retention design using symbolic simulation
Abstract—Addressing both standby and active power is a major challenge in developing System-on-Chip designs for batterypowered products. Powering off sections of logic or memorie...
Ashish Darbari, Bashir M. Al-Hashimi, David Flynn,...
DATE
2007
IEEE
104views Hardware» more  DATE 2007»
15 years 10 months ago
Dynamic reconfiguration in sensor networks with regenerative energy sources
In highly power constrained sensor networks, harvesting energy from the environment makes prolonged or even perpetual execution feasible. In such energy harvesting systems, energy...
Ani Nahapetian, Paolo Lombardo, Andrea Acquaviva, ...
CODES
2006
IEEE
15 years 10 months ago
Data reuse driven energy-aware MPSoC co-synthesis of memory and communication architecture for streaming applications
The memory subsystem of a complex multiprocessor systemson-chip (MPSoC) is an important contributor to the chip power consumption. The selection of memory architecture, as well as...
Ilya Issenin, Nikil Dutt