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116
Voted
ICCD
2005
IEEE
16 years 18 days ago
2005
IEEE
As technology scales, interconnects dominate the performance and power behavior of deep submicron designs. Three-dimensional integrated circuits (3D ICs) have been proposed as a w...
143
Voted
ICCD
2005
IEEE
16 years 18 days ago
2005
IEEE
Presently, Architecture Description Languages (ADLs) are widely used to raise the abstraction level of the design space exploration of Application Specific Instruction-set Proces...
138
Voted
ICCD
2004
IEEE
16 years 18 days ago
2004
IEEE
I/O placement has always been a concern in modern IC design. Due to flip-chip technology, I/O can be placed throughout the whole chip without long wires from the periphery of the...
126
Voted
ICCD
2004
IEEE
16 years 18 days ago
2004
IEEE
We present a method for incorporating crosstalk reduction criteria into global routing under an innovative power supply architecture, while considering the constraints imposed by ...
112
Voted
ICCD
2001
IEEE
16 years 18 days ago
2001
IEEE
Microprocessor performance has been improved by increasing the capacity of on-chip caches. However, the performance gain comes at the price of increased static energy consumption ...