Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
In this paper, we propose a new framework for online handwritten mathematical expression recognition. The proposed architecture aims at handling mathematical expression recognitio...
Abstract-- The next generation of computers will be embossed by ubiquitous systems. The computer will disappear behind daily artifacts and will support people in their everyday lif...
Faruk Bagci, Julian Wolf, Theo Ungerer, Nader Bagh...
The UAE location on the edge of a very warm sea and hot and dry desert create the optimal conditions of inland fog forming. The afternoon sea breeze, which is almost a daily event...
Abdulla Bushahab, Ali Al Suwaidi, Hosni Ghedira, K...
We study (collapsible) higher-order pushdown systems -- theoretically robust and well-studied models of higher-order programs -- along with their natural subclass called (collapsi...