Three-Dimensional integration provides a simultaneous improvement in wire-related delay and power consumption of microprocessor circuits. Prior work has looked at the performance,...
Recent advances in tester technology have led to automatic test equipment (ATE) that can operate at up to several hundred MHz. However, system-on-chip (SOC) scan chains typically ...
Anuja Sehgal, Vikram Iyengar, Mark D. Krasniewski,...
Electrothermal couplings between supply voltage, operating frequency, power dissipation and die temperature have been shown to significantly impact the energy-delay-product (EDP) ...
Anirban Basu, Sheng-Chih Lin, Vineet Wason, Amit M...
As process technology migrates to deep submicron with feature size less than 100nm, global wire delay is becoming a major hindrance in keeping the latency of intra-chip communicat...
Mongkol Ekpanyapong, Jacob R. Minz, Thaisiri Watew...
Power optimization is of growing importance for FPGAs in nanometer technologies. Considering dual-Vdd technique, we show that configurable power supply is required to obtain a sat...