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DAC
2007
ACM
15 years 11 months ago
Scalability of 3D-Integrated Arithmetic Units in High-Performance Microprocessors
Three-Dimensional integration provides a simultaneous improvement in wire-related delay and power consumption of microprocessor circuits. Prior work has looked at the performance,...
Kiran Puttaswamy, Gabriel H. Loh
DAC
2003
ACM
15 years 11 months ago
Test cost reduction for SOCs using virtual TAMs and lagrange multipliers
Recent advances in tester technology have led to automatic test equipment (ATE) that can operate at up to several hundred MHz. However, system-on-chip (SOC) scan chains typically ...
Anuja Sehgal, Vikram Iyengar, Mark D. Krasniewski,...
DAC
2004
ACM
15 years 11 months ago
Simultaneous optimization of supply and threshold voltages for low-power and high-performance circuits in the leakage dominant e
Electrothermal couplings between supply voltage, operating frequency, power dissipation and die temperature have been shown to significantly impact the energy-delay-product (EDP) ...
Anirban Basu, Sheng-Chih Lin, Vineet Wason, Amit M...
DAC
2004
ACM
15 years 11 months ago
Profile-guided microarchitectural floorplanning for deep submicron processor design
As process technology migrates to deep submicron with feature size less than 100nm, global wire delay is becoming a major hindrance in keeping the latency of intra-chip communicat...
Mongkol Ekpanyapong, Jacob R. Minz, Thaisiri Watew...
DAC
2004
ACM
15 years 11 months ago
FPGA power reduction using configurable dual-Vdd
Power optimization is of growing importance for FPGAs in nanometer technologies. Considering dual-Vdd technique, we show that configurable power supply is required to obtain a sat...
Fei Li, Yan Lin, Lei He