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» Computer Aided Design Modeling for Heterogeneous Objects
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ISLPED
2007
ACM
169views Hardware» more  ISLPED 2007»
14 years 11 months ago
Throughput of multi-core processors under thermal constraints
We analyze the effect of thermal constraints on the performance and power of multi-core processors. We propose system-level power and thermal models, and derive expressions for (a...
Ravishankar Rao, Sarma B. K. Vrudhula, Chaitali Ch...
TOG
2010
89views more  TOG 2010»
14 years 4 months ago
Volumetric modeling with diffusion surfaces
The modeling of volumetric objects is still a difficult problem. Solid texture synthesis methods enable the design of volumes with homogeneous textures, but global features such a...
Kenshi Takayama, Olga Sorkine, Andrew Nealen, Take...
DAC
2006
ACM
15 years 11 months ago
Standard cell characterization considering lithography induced variations
As VLSI technology scales toward 65nm and beyond, both timing and power performance of integrated circuits are increasingly affected by process variations. In practice, people oft...
Ke Cao, Sorin Dobre, Jiang Hu
ICOODB
2009
94views Database» more  ICOODB 2009»
14 years 7 months ago
Metamodelling with Datalog and Classes: ConceptBase at the Age of 21
ConceptBase is a deductive object-oriented database system intended for the management of metadata. A distinguishing feature of the Telos language underlying ConceptBase is the abi...
Matthias Jarke, Manfred A. Jeusfeld, Hans W. Nisse...
VLSID
2009
IEEE
144views VLSI» more  VLSID 2009»
15 years 10 months ago
Exploring Carbon Nanotube Bundle Global Interconnects for Chip Multiprocessor Applications
The current paradigm of using Cu interconnects for on-chip global communication is rapidly becoming a serious performance bottleneck in ultra-deep submicron (UDSM) technologies. C...
Sudeep Pasricha, Nikil Dutt, Fadi J. Kurdahi