As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
This paper describes a new force directed global placement algorithm that exploits and extends techniques from two leading placers, Force-directed [12] [26] and Mongrel [22]. It c...
The interesting properties of P2P systems (high availability despite peer volatility, support for heterogeneous architectures, high scalability, etc.) make them attractive for dist...
In this paper we present a sketch modelling system which we call Stilton. The program resembles a desktop VRML browser, allowing a user to navigate a 3D model in a perspective pro...
The process of creating e-learning contents using reusable learning objects (LOs) can be broken down in two sub-processes: LOs finding and LO sequencing. Sequencing is usually per...