Field programmable dual-Vdd interconnects are effective to reduce FPGA power. Assuming uniform length interconnects, existing work has developed time slack budgeting to minimize p...
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
Hao Hua, Christopher Mineo, Kory Schoenfliess, Amb...
With ever-increasing power density and cooling costs in modern high-performance systems, dynamic thermal management (DTM) has emerged as an effective technique for guaranteeing th...
Amit Kumar 0002, Li Shang, Li-Shiuan Peh, Niraj K....
Due to the shrinking of feature size and reduction in supply voltages, nanoscale circuits have become more susceptible to radiation induced transient faults. In this paper, we pre...
In a placed circuit, there are a lot of movable cells that can be flipped to further reduce the total wirelength, without affecting the original placement solution. We aim at solv...
Chiu-Wing Sham, Evangeline F. Y. Young, Chris C. N...