Today, finite element technologies allow engineers to analyze complex assemblies and subsystems. With CPU power constantly increasing, it is not unreasonable to state that the eng...
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
Abstract. Symbolic execution is a flexible and powerful, but computationally expensive technique to detect dynamic behaviors of a program. In this paper, we present a context-sensi...
In this paper we describe a new technique, called pipeline spectroscopy, and use it to measure the cost of each cache miss. The cost of a miss is displayed (graphed) as a histogra...
Thomas R. Puzak, Allan Hartstein, Philip G. Emma, ...
As embedded computing evolves towards ever more powerful architectures, the challenge of properly interconnecting large numbers of on-chip computation blocks is becoming prominent...
Antonio Pullini, Federico Angiolini, Paolo Meloni,...